Hello Jerry,
I suggest you to look at the following papers:
Thierry Corman, Peter Enoksson and G=F6ran Stemme, "Deep wet etching of
borosilicate glass using an anodically bonded silicon substrate as
mask", Journal of Micromechanics and Microengineering 8 (1998) 84-87.
Shuichi Shoji, Hiroto Kikuchi and Hirotaka Torigoe, "Low-temperature
anodic bonding using lithium aluminosilicate-B-quartz glass ceramics",
Sensors and Actuators A 64 (1998) 95-100.
As described in these two papers it is difficult to etch deep in pyrex
glass with a conventional Cr/Au mask. A practical solution is to use
SD-2 glass instead of pyrex, which etches faster than pyrex with less
underetching: with a conventional Cr/Au/resist mask it is possible to
etch through the SD-2 glass (500 =B5m). As pyrex, SD-2 is suitable for
anodic bonding with silicon.
Good luck!
Thierry
>hi, Everybody:
> I am trying to etch microchannel on glass (borosilicate glass,7740),
>but, lack of the support to do LPCVD poly-silicon on glass, the only
subsitution
>I know is Cr/Au, but I really don't know if it can resist deept
etching for me,
>about 320 mu m...
> Besides, I don't know if amorphous silicon can resist to HF etching,
>I want to do deep etching, so I will use HF about 48% solution...
> Any suggestions will be granted! I will appreciate..
>
> Thanks a lot,
> Sincerely
>
>Jerry Lee
>Insitute of Applied Mechanics
>email: r6543023@gauss.iam.ntu.edu.tw / iamjhlee@email.com
>
>=20