Dear MEMS community,
Here's a summary of responses to my original question of glass drilling
technology. I have found nine possible methods for machining glass wafer.
I also list contact info or service links forwared to me. Hope this helps
to people who are interested in this issue. Thank you all for your inputs.
Glass machining methods, potential for large production, smoothness,
conical or tapered profile
1. Mechanical drilling no
rough no
2. Ultrasonic drilling yes
rough yes
3. Laser drilling yes
smooth yes
(eximer and CO2)
4. Micro-sandblasting yes
(?) yes
(Crystal Mark, Mems, Inc)
5. Ultrasonic drilling w/EDM ?
no no
(Prof. Masuzawa team in Tokyo University)
6. FIB ?
smooth yes
7. FIB enhanced etching yes
unknown unknown
(Norsam Technologies)
8. Selective etching with photosensitive glass (Foturan)
yes
unknown unknown
9. chemical-assisted laser etching
(Revise Inc., DARPA project)
unknown
unknown unknown