Hello
I am trying to dice up some samples on an SOI substrate for waveguiding
applications. I have a problem that the device layer always has little
chips near the edge after the saw cut, and I haven't managed to polish
them out yet.
Can somebody suggest:
1. An ingenious sawing technique that won't chip the edges.
(covering the sample in a very hard material for example)
or 2. A mechanical polishing technique that won't take until the next ice
age to produce clean waveguide ends.
Thanks very much
Olly Powell
School of MEE
Griffith University
Australia