RE: Backside wafer alignment & sawing without polishing
Gilbert, Jeffery J (Jeffery)
2001-02-12
Disco has a 300 series dicing saw with an IR scope. Contact Lyons &
Associates, Joe Raffa (215) 750-6346 832 Belleveu Ave., Hulmeville, PA 19047
for further details. I do not know how good this equipment works.
Regards,
Jeff
Jeffery J Gilbert
Rm 22Y-168 EO
555 Union Boulevard
Allentown, PA 10103-1229
Ph # (610)712-7129
Fax # (610)712 7208
email: jjg6@agere.com
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From: Dean Eshleman [SMTP:dreshleman@earthlink.net]
Sent: Friday, February 09, 2001 8:40 PM
To: MEMS@ISI.EDU
Subject: Backside wafer alignment & sawing without polishing
Has anyone had success in finding/developing a dicing saw with a
vision
system that can see through the backside of the wafer onto the
surface
circuitry for alignment purposes WITHOUT having to backpolish the
wafer?
I have seen standalone vision tests done using IR on a 7405m thick
wafer
with slightly grainy results, but good enough for a human to
decipher.
1) Are there any better vision solutions out there? or
2) Is there imaging software that can take grainy results and
process it in
a way suitable for automatic alignment/pattern recognition on a
dicing saw?
Your advice/experience is much appreciated,
Dean R. Eshleman