Dear MEMS colleagues,
I have two questions Related two the use of TMAH:
1) What percentage of Si or Al, (or solution), in TMAH would suppress
Aluminium or Cr etching.
2) Has anyone, encountered any problems with etching polycrystalline silicon
(100), taking
into account there is no oxide present - this has just happen to me all of a
sudden.
-->some other matrial on top or change in orientation of poly - wild guess?
any suggestion with regards to 2) will be much appreciated!!!!
thank you for your interest,
Philip Lau
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