Dear Lisen,
SU-8 is a chemically amplified epoxy based photoresist therefore after
curing, exposure and PEB, the resist is somewhat impenetrable by
standard resist removers or strippers....There has been a lot of work in
this field recently with a whole host of companies performing
evaluations using RIE with Fluorinated gases such as NF3 & SF6, those
include Matrix, Trion Technologies and Yield Engineering.....There is
also another method for the removal of cured SU-8, Molten Salts from a
company called Kolene Corporation, this process is still in it's infancy
but holds a lot of promise, especially for very thick films.....
Because of all the known problems with the processing and removal of
SU-8 we at MicroChem Corp have developed a Release Layer for use beneath
the SU-8...Not only does it allow for complete and clean removal of the
SU-8 but it also dramatically improves the adhesion on a wide variety of
coatings....This Release Layer is spin coated onto the substrate/seed
layer to a film thickness of around 170A and baked....From here standard
SU-8 processing can be performed....
If you need more information on this product or require additional
processing guidance for the SU-8 please contact me....
Mark Shaw
MicroChem Corp.