Ultrasonic Machining would provide excellent results at this size. Please
feel free to contact me or visit our WEB site at www.bullen-ultrasonics.com.
Mary Bullen
Bullen Ultrasonics, Inc.
(937)456-7545
Eaton, OH USA
-----Original Message-----
From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org] On
Behalf Of Roger Brennan
Sent: Saturday, February 23, 2002 8:06 AM
To: 'mems-talk@memsnet.org'
Subject: [mems-talk] Drilling through holes
Hi everybody!
I'm now wet etching to make through holes in 12 mil (305 microns) <100> Si.
The desired hole size is about 10 mils by 30 mils (254 microns by 762
microns).
Is laser or physical drilling a possible alternative?
How about deep RIE?
Thanks.
Roger Brennan
Home:
1403 Forrestal Avenue
San Jose, CA 95110
(408)453-0711 (telephone)
(408)573-9407 (fax)
rogerbr@earthlink.net
Work:
Endevco
355 N. Pastoria Ave.
Sunnyvale, CA 94085
408-739-3533 ext 204
roger.brennan@endevco.com
_______________________________________________
mems-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/