Hello Frank,

At AML we run courses on wafer bonding as well as being a wafer bonding
equipment manufacturer. You can get details from our website, www.aml.co.uk.

Regards

Tony

Tony Rogers
Applied Microengineering Ltd
173 Curie Avenue
Didcot
OX11 0QG
Tel.: +44 (0)1235 833934
Fax: +44 (0)1235 833935
e-mail: tony@aml.co.uk

Web:http://www.aml.co.uk

-----Original Message-----
From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org]On
Behalf Of BERAUER,FRANK (HP-Singapore,ex7)
Sent: 07 March 2002 09:53
To: 'mems-talk@memsnet.org'
Subject: [mems-talk] Wafer Bonding Information?


Dear fellow MEMS researchers,

I would like to get an overview of wafer bonding techniques.
I am especially interested to know which materials can be bonded
together by which bonding techniques and what advantages and dis-
advantages there are. Also, which equipment manufacturers there
are. I would be grateful if somebody can point me to good sources
of information or literature.

Thanks and have a nice day,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore
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