Hello,
500 um is a hugh depth, I dont know what is your feature size. SiO2 will
not withstand KOH and there are problems even with TMAH. My suggestion is
that you use Ethylene Diamine + Pyrocatechol mixture, where SiO2 will serve
as an effective etch mask.
Regards
Amit Shiwalkar
aslam muhammad wrote:
> Hi Friends
>
> I want to use TMAH and KOH as etchant to
> etch bulk silicon ( 500 micron). which one is more
> suitable. my etch mask is SiO2. what is the recipe
> of a good etching rate KOH and TMAH please.
>
> Thankx
>
> M. Aslam
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