Dear All,
I have a problem trying to find a way of detecting the end point of a via
etch which has a 1um layer of Cr on top of a 2um layer of SiO2 to be
etched. We are currently relying on a visual inspection to determine the
end point. Rather than just rely on visual inspection does anyone know of
any other methods that might make this process more robust without
installing a end point detector on our etcher?.
hope you can give me some ideas,
many thanks,
Iain Watson.
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