This is analogous to the fruitless attempt to fill a beaker with water by
dipping its open end flat into the liquid. Of course, tipping the beaker
allows the water in.
Suggestion: Apply an appreciable drop in the middle of the wafer. No
spin! Let the capillary force do the rest. Continue slow application in
the middle until wafer is covered. Then spin. Of course, high viscosity
will test your patience.
Goodluck
Robert.
At 01:06 PM 05/15/2002 -0700, hongyuyu wrote:
>Hi, friends
>
>In bulk microfabrication, I tried to fill a deep channel, which is around
>200um. When I use AZ5214, there are lots of air bubbles coming out when I
>bake it. So how can I solve this problem?
>Do I need to use different PR? High thick PR?
>I want to try SU-8, but my friends told me that is a dirty material and
>not easy to remove after baking.
>Thanks a lot
>Hongyu
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