Rob,
What type of wafer is it? (Silicon)
What is the max thickness you will need to cut and the kerf width you need?
-----Original Message-----
From: Avi.Laker@teccor.com [mailto:Avi.Laker@teccor.com]
Sent: Thursday, September 05, 2002 12:29 PM
To: mems-talk@memsnet.org
Cc: rhsmith@kns.com
Subject: K&S SAW MODIFICATION - MEMS-talk digest, Vol 1 #392 - 5 msgs
Rob,
Contact Robert Smith at K&S in PA excellent source
for information and saw technology. If it can be done
he'll know how.
215 784 6533
avi
Message: 5
From: "RobDavis"
To:
Date: Thu, 5 Sep 2002 08:02:36 -0700
Subject: [mems-talk] Wafer saw modifications
Reply-To: mems-talk@memsnet.org
Want to modify K&E wafer saw to cut thicker wafer, bonded material. Any
clue how thick the substrate can be? Can I take the cut up to the
reinforcement ring for the blade? Any ideas on diamond blade cost and
supplier?
Thanks
Rob
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