We are trying to use KOH to place a 5 micron deep etch on one side of
silicon wafer, and 25 micron on other side. We are looking for a
protective coating we could apply to one side of the wafer after we've
done the first 5 microns of the etch, then continue with the final etch
on the other side. Can anyone suggest a solution to this two step etch
process ? Possibly a spin-on layer to be removed after the etching ?
Thanks,
Jim Stackhouse
Phil Klauder