Dimitris,
         Get the standard 22 degree slope back angle.  Then plasma clean with a
gentle Oxygen descum and or argon plasma surface roughness modification to
promote Si/Ag adhesion.  I have a number of technical papers on lift off and a
few production inputs on plasma treatment.  Contact me directly for more
information.  Bill Moffat

-----Original Message-----
From: Dimitris Niarchos [mailto:hidemar@ims.demokritos.gr]
Sent: Monday, March 03, 2003 7:36 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Sputtering Ag on Si


Does anyone know  a good way to deposit Ag on Si - good adhesion - for
further lift-off process?


_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/