Hi, friends
I plan to deposit LPCVD amorphous silicon on glass wafer: corning 0211 and
schott borofloat glass to make mask to isotropically etch 30um deep channle
on glass wafer.I have the following problem to ask
1. it is necessary to clean glass wafer before put wafer into furnace? if
necessary, which kind of clean process: prinha or RCA?
2. Except isotropical etching, i donot want any overetching. Also i need
nice etching for glass fusin or anodic bonding later on. which is typical
thickness for LPCVD amorphous silicon mask for glass etching that i
mentioned above?

thanks
Dlee
Mechanical Engineering Department
The University of Texas at Austin






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