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Ti etchant not attack glass (Ming Li)
rotation in ANSYS (Jianhui Zhao)
details on microfluidics (Vladimer Michael)
DRIE of BCB (Joachim Oberhammer)
Diffusion barrier for Ga into Au (Steven McMaster)
Ti etchant not attack glass (Jauniskis, Linas)
Diffusion barrier for Ga into Au (Gary)
Through Hole etching of evry deep holes - Aspect ratio- 25-30 (Hongjun-ECE)
Re: Ti etchant not attack glass (Eric Woods)
Ti etchant not attack glass (WILLIAMSON Fraser)
details on microfluidics (Andrew)
PLZT or PNZT film (Yongsheng Liu)
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