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  • Ti etchant not attack glass (Ming Li)
  • rotation in ANSYS (Jianhui Zhao)
  • details on microfluidics (Vladimer Michael)
  • DRIE of BCB (Joachim Oberhammer)
  • Diffusion barrier for Ga into Au (Steven McMaster)
  • Ti etchant not attack glass (Jauniskis, Linas)
  • Diffusion barrier for Ga into Au (Gary)
  • Through Hole etching of evry deep holes - Aspect ratio- 25-30 (Hongjun-ECE)
  • Re: Ti etchant not attack glass (Eric Woods)
  • Ti etchant not attack glass (WILLIAMSON Fraser)
  • details on microfluidics (Andrew)
  • PLZT or PNZT film (Yongsheng Liu)
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