Submitted by: Bryon Moyer, Editor of EE Journal Sensor fusion has been all the rage over the last year. We've all watched as numerous companies – both makers of sensors and the “sensor-agnostic” folks – have sported ...
CEA-Leti today announced a development agreement that will utilize Leti's deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, ...
... Jin Zhang of Xi'an Technological University (China) and colleagues at Cardiff University (UK), who are partners of the EU FP7 LaserNaMi project, have devised an approach to lithography, the process used to “print” microelectronic circuits, that ...
Apple upped the ante with its iOS 7 software upgrade by incorporating layers of parallax that respond to the iPhone's internal micro-electro-mechanical (MEM) gyroscope. The gyroscope measures angular velocity. Originally used in navigation of ships ...
Researchers under DARPA's Terahertz Electronics (THz) program have designed and demonstrated a 0.85 Terahertz power amplifier using a micromachined vacuum tube-a world's first. The achievement comes from DARPA-funded researchers at Northrop ...
