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MEMS technology

Packaging advances needed to ensure IoT growth
While MEMS and CMOS devices share a number of similarities ... Figure 1 illustrates several SiP design options that could include wafer-level packages, 2.5D or 3D structures, flip-chip, wire bonding, package-on-package, and more. A SiP can also include ...
EDN Network: 2016-07-27 - MEMS technology
New telecoms architecture to boost data speed and cut technology costs
The project has demonstrated that its technology will allow higher bit rates ... low-parasitic copper micro pillars. FABULOUS carried out sub-system demonstrations to show the effectiveness of the standalone components. It also carried out a whole ...
Phys: 2016-07-25 - MEMS technology
Wafer bonding to integrate silicon, gallium arsenide, and gallium nitride
Researchers based in Singapore and the USA have been developing a process for bonding wafers that allows them to integrate gallium arsenide (GaAs), gallium nitride (GaN) and silicon (Si) CMOS layers [Kwang Hong Lee et al, Appl. Phys. Express vol9, p086501 ...
Semiconductor Today: 2016-07-26 - MEMS technology
A graphene window to better microfluidics
(Nanowerk News) Working with protein microcrystals can be an enormously challenging endeavor. Aside from their extremely small size, microcrystals can be delicate, difficult to handle, and susceptible to radiation damage from x-ray diffraction studies.
Nano werk: 2016-07-26 - MEMS technology
Transistors will stop shrinking in 2021, but Moore’s law will live on
With recent nodes like 22 or 14nm, though, there are so many additional steps required that it costs a lot more to manufacture a completed wafer—not to mention additional costs for things like package-on-package (PoP) and through-silicon vias (TSV ...
Ars Technica: 2016-07-25 - MEMS technology

MEMS business

SEMulator3D From Coventor Wins "Best of the West" Product Award
Coventor's SEMulator3D is a 3D virtual fabrication platform that predictively models ... With shrinking process technologies, parasitic effects of devices and interconnects have a significant impact on circuit performance. SEMulator3D 6.0 addresses this ...
EIN Newsdesk: 2016-07-28 - MEMS business
A*Star launches silicon photonics and MEMs packaging consortia
The A*STAR Institute of Microelectronics (IME; Singapore) has launched two consortia for advanced packaging: the Silicon Photonics Packaging consortium (Phase II) and the MEMS Wafer Level Chip Scale Packaging (WLCSP) consortium. Each will develop novel ...
laserfocusworld.com: 2016-07-26 - MEMS business
Microchip Releases Demonstration Platform Based on Industrys Lowest Power BLE Sensor Node for IoT Applications
Bosch Sensortec GmbH is a fully owned subsidiary of Robert Bosch GmbH that is dedicated to delivering a complete portfolio of microelectromechanical systems (MEMS) sensors and solutions that enable consumer electronics to be connected. Bosch Sensortec ...
Press Release Point: 2016-07-25 - MEMS business

Nanotechnology

A new nanotech approach for treating stomach cancer
The new treatment modality is based on a transport platform developed as part of Maya Bar-Zeev’s doctoral dissertation at the Russell Berrie Nanotechnology Institute, under the joint supervision of Prof. Yoav Livney of the Faculty of Biotechnology ...
Israel 21c: 2016-07-28 - Nanotechnology
Promise of Nanowires in Optoelectronics Realized By Getting Them Connected
In research described in the journal Nature Nanotechnology, the international team of researchers fabricated a photovoltaic device in which they managed to connect and integrate hundreds of organic nanowires. This is a significant achievement, because ...
IEEE Spectrum: 2016-07-26 - Nanotechnology
Moving beyond semiconductors for next-generation electric switches
Efficient control of electron motion can be used to reduce the power requirements of computers. “Quantum wells” (QW) are regions that allow electron motion in only two dimensions. The lines (bottom) in the schematic show the probability of finding ...
Nano werk: 2016-07-28 - Nanotechnology

Featured Event

Micro Photonics International Congress Expo

Event Calendar

Sensors Midwest
2016-09-27 - 2016-09-28
Rosemont, IL
uTAS 2016
2016-10-09 - 2016-10-13
Dublin, Ireland
The 20th International Conference on Miniaturized Systems for Chemistry and Life Sciences
Micro Photonics International Congress Expo
2016-10-11 - 2016-10-13
Messe Berlin Germany
Innovation and Miniaturization in Photonics
MEMS and Sensors Executive Congress US 2016
2016-11-09 - 2016-11-11
Scottsdale, Arizona
CAPTURING VALUE FROM MEMS AND SENSORS
MEMS 2017
2017-01-22 - 2017-01-26
Las Vegas, Nevada
The 30th Annual IEEE International Conference on Micro Electro Mechanical Systems

MEMS & Nanotechnology Exchange
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