To secure a technical position in the MEMS/Nanotech/Semiconductor Industry
Skills
Semiconductor Failure Analysis (silicon and GaAs) and Reliability; Dual beam FIB systems; SEM analysis; TEM sample preparation
Qualifications
Over six years direct experience in the semiconductor industry performing physical and electrical failure analysis (FA) on silicon and gallium arsenide IC products. Interpreted electrical test data to aid in locating physical defects. Worked closely with failure analysis engineers and quality assurance personnel to characterize fail modes and defect mechanisms. Extensive hands-on knowledge of a wide variety of failure analysis techniques and toolsets, including: wet chemistry deprocessing, mechanical cross-sectioning, parallel polishing, focused ion beam systems (FIB), scanning electron microscopy (SEM), transmission electron microscopy (TEM) sample preparation, photon emission microscopy (PEM), energy dispersive x-ray (EDX) for elemental analysis, scanning acoustic microscopy (SAM), reactive ion/plasma etchers (RIE), and various MS and Unix based software including Cadence, Knights/Merlin, BView, and MS Office suite. I currently possess an accredited AAS in Electronic Systems Technology which I recieved from the Community College of the Air Force (CCAF). Prior to working in the semiconductor industry I was an active duty member of the United States Air Force for six years as an electronics technician. During that time I maintained a wide variety of ground radio communications systems and air traffic control subsystems.