Taiwan-based United Microelectronics (UMC) has announced it is teaming up with dedicated MEMS foundry Asia Pacific Microsystems (APM) to provide enhanced MEMS manufacturing services for mutual customers. UMC will leverage its 8- and 12-inch production ...
senior director of integrated interconnect and packaging technology at TSMC, as saying. SEMI believes that semiconductor fab equipment spending will gain momentum through the end of 2016. For 2017, 13% growth is forecast. Activity in the 3D NAND ...
GRENOBLE, France – 6 September 2016 - Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016. Following 2015’s highly successful debut in Milano, the ...
The targeted etching process of “nanoscale-sculpturing” roughens the upper layer of metal (here aluminium, 20 µm = 0.02 mm), thereby creating a 3D-structure with tiny hooks. A surface treated with this process can inter-lock like a three-dimensional ...
A novel fabrication process from the Capasso lab develops highly efficient planar metalenses that allow for diffraction-limited focusing, unprecedented imaging quality, and the ability to resolve chirality. 6 September 2016, SPIE Newsroom. DOI: 10.1117/2 ...
