Hi all,
I was wondering if people are aware of a good
vapor phase anti-stiction coating that can
be applied to previously released devices, at a
relatively low temperature around 100C.
I am aware of some work at Berkeley, applying
DDMS and FDTS from a water plasma.
Are there commercial systems available?
At one point I thought I saw a post from Yield
Engineering about a system used on the TI DMD.
Is this approach similar to HMDS wafer priming?
ADI patent info and perusal through a Gelest catalog
suggests that they applied a rather bulky looking
Siloxane prior to packaging. Has anyone else had
experience with this?

Thanks in advance for your feedback.

Regards,

Dave Kharas Ph.D.




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