At 05:17 PM 6/6/2003 +0000, you wrote:
>Hi,
>ths is dlee from Ut austin. I try to bond two piece of PDMS layer toghter
>with O2 RIE. The paramter is  O2 10sccm, 45 mtorr, 100watts. but bonding
>result is bad. I also try O2 20sccm, 70 mtorr and 75 watts, also the result
>is noy good. In my case, i need high strength bonding, at the least the
>bonding can stand 20-30 psi. I read some paper. It was said O2 RIE bonding
>can stand 50psi pressure. I am not sure what is wrong with my process.
>Anybody has suceed to achieve such good bonding strength (>30psi), any
>suggestion will be appreciated.
>
>Thanks
>Dlee
>Mechanical Engineering Department
>The University of Texas At Austin

The method I suggested to one of the people here is to do just a partial
cure on the pdms.  You need just enough strength to prevent tearing when
you remove it from the master.  Then do the O2 treatment and the bond
followed with the remainder of the PDMS heat cure.
I don't know what you design is like, but it's best to avoid uninterupted
large-area features.

--
Mark Fuller
Microelectronics Fabrication Facility
Washington State University
Dana Hall 102
Pullman, WA  99164-2711
(509)335-1797