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MEMSnet Home: MEMS-Talk: fluorocarbon residue removal in silicon DRIE
fluorocarbon residue removal in silicon DRIE
2003-12-05
roberto Campedelli
2003-12-05
Debjyoti Banerjee, Ph.D.
2003-12-08
Sunil Kumar
fluorocarbon residue removal in silicon DRIE
Sunil Kumar
2003-12-08
Fluorocarbon like C4F8 can be removed after a DRIE run by doing a 10-15 minute
piranha etch (5:1 98% H2SO4: 30% H2O2)
you can also try ammonium persulphate instead of H2O2, since its an exothermic
reaction, there is no need to heat the solution

-Sunil

  ----- Original Message -----
  From: roberto Campedelli
  To: mems-talk@memsnet.org
  Cc: roberto.campedelli@st.com
  Sent: Friday, December 05, 2003 2:28 PM
  Subject: [mems-talk] fluorocarbon residue removal in silicon DRIE


  Hello, did you solve the problem with removing fluorocarbon polymers?

  Roberto Campedelli
  process engineer STMicroelectronics

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