Some organizations are considering doing dicing in an ICP configured for
Deep Si Etch.  If you would like more information do not hesitate to contact
me.
Cheers,
Greg Ortiz
Surface Technology Systems
West Coast Regional Sales Manager
611 Veterans Blvd., #107
Redwood City, CA  94063
Phone 650 569 3655 x16
Mobile 408 499 5689
Fax      650 569 3663
Email   GregOrtiz@att.net
www.stsystems.com
----- Original Message -----
From: "Qingwei Mo" 
To: "'Qingwei'" ; "'General MEMS discussion'"

Sent: Sunday, December 07, 2003 9:34 PM
Subject: [mems-talk] RE: MEMS wafer dicing



Hi,

I am looking for some suggestions for MEMS wafer dicing, either suitable
techniques or mature service provider. What I am working on is 4 inch wafer
made by wafer bonding and bulk micromachining. The device can not be exposed
to water as you know. I have tried laser dicing; the results are not very
good.

I really appreciate your suggestions and information.

Best regards,

Qingwei


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