What is the expected tolerance for sidewall angle when DRIE 'etching a Si
substrate 500um thick?
I need to etch an arrayed die pattern consisting of two holes 125um and
155um diameter. The two holes are spaced 150 um apart and the die are ~1mm
apart. I want to etch 125 um diameter hole through the 500um thick wafer
and obtain a negative sidewall profile no greater than 1 degree and a
backside hole diameter of 125um +17um / -0um. Likewise, I need the 155um
diameter hole to have a negative sidewall profile no greater than 1 degree
and a backside hole diameter of 155um +17um / -0um.
Thank you in advance for any guidance,
Paul
_________________________________________________________________
Click here for a FREE online computer virus scan from McAfee.
http://clinic.mcafee.com/clinic/ibuy/campaign.asp?cid=3963