U can use
AZ4562 and spin it at
6000rpm for 30 sec that you give u about 5µm but before that u can spin on HMCTS
at 4250rpm for 25sec.....This will be fine on silicon surfaces....if you brebake
it well; 100°C/1min hotplate and 100°C/abt 10min in oven.....i dont know if u r
using hotplate or oven....
But you cannot use these adhesion promoters on Alu for example....with alu you
only have to coat the resist.....so the surface in question is also a
factor...not all surfaces need adhesive promoters...
U can also try TI prime instead of HMCTS but you have to bake TI prime before
coating the resist.
i hope this helps
--- On Sat, 7/18/09, Andrea Mazzolari wrote:
From: Andrea Mazzolari
Subject: [mems-talk] improve photoresist adhesion
To: "General MEMS discussion"
Date: Saturday, July 18, 2009, 1:48 PM
Hi All,
I need to deposit a photoresist of thickness about 5um, and pattern it in
order to relize structures of lateral sizes 4x1000um. I tried using AZ9260
photoresist, but i had adhesion problems after development step.
I used HMDS as adhesion promoter.
I also tried to use a O2 plasma before photoresist spinning, but it did
not helped.
Any suggestions to improve photoresist adhesion ?
Best regards,
Andrea