Hi Michael, Your problem might be the exposure dose. If you are using the
same time for glass and silicon for exposure, you might be under exposing the
photoresist because of the reflectivity difference in the two substrates. This
might make the photoresist dissolve more slowly and, thereby, reduce the
apparent undercut rate for the LOR.
> From: email@example.com
> To: firstname.lastname@example.org
> Date: Mon, 26 Aug 2013 16:32:40 +0000
> Subject: [mems-talk] LOR 3A and Borosilicate
> Does anyone have experience with LOR3A (w/ 1827) on borosilicate glass. The
processing parameters, i.e. undercut rate after a 6 min 150C bake, appear quite
different than those for silicon. That is, I am seeing a much lower undercut
rate for the borosilicate than for silicon.
> Thank you,
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