Hello Ricky,
the standard photoresist are not optimized for copper surfaces (except the
PCB resists). I would recommend the usage of an adhesion promoter like
TI-Prime (microchemicals, Ulm, Germany). The other problem of staining of
the copper has its reason in the metal-ion-free TMAH tetramethyl
ammonium hydroxide as the main component of your developer. This substance
is able to attack slightly the copper under forming a complex. A KOH-based
developer would work much better.
Best regards/Mit freundlichem Gruß
André Bödecker
Institut für Mikrosensoren, -aktoren und -systeme
Universität Bremen Fachbereich 1
Otto-Hahn-Allee1
28359 Bremen
Tel: 0421 218 62596
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