Hi Cormac,
Try resinoid blades with 30-45u diamond. blade spped (on 21/4" blade) ~21KRPM

Shay

Cormac Eason wrote:

> Hi all,
>
> Could anyone recommend a dicing saw blade or blades suitable for cutting
> the following combinations of materials:
>
> Silicon (0.5mm thick) anodically bonded to Pyrex (0.5mm thick)
>
> Pyrex (0.5mm thick) spin coated with a 5 micron layer of SU 8
>
> Silicon (0.5mm), with an electroplated Copper layer (0.4mm), topped with a
> 5 micron thick SU 8 layer and a 0.5mm Pyrex layer.
>
> Thicknesses are approximate at the moment, but the maximum depth to which
> I'll be cutting will be < 1.5mm
>
> The thickness of the blade doesn't matter to me as there is plenty of room
> between samples, though the more vertical the cut edges are the better.
> Thanks in advance for all assistance.
> --
>
> Regards,
> Cormac Eason
>
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