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MEMSnet Home: MEMS-Talk: Glass or Silicon Bonding to Polymer
Glass or Silicon Bonding to Polymer
2003-01-10
Jennifer Pagan
2003-01-10
Bill Moffat
Glass or Silicon Bonding to Polymer
Jennifer Pagan
2003-01-10
Frank,

         We have some experience with making microfludic channels and
doing a bond as you have described. Please call me so we can discuss it
in detail.

Jennifer Pagan
Senior Process Engineer
WaveguideSolutions, Inc.
Jpagan@WaveguideSolutions.com
Phone: 704-927-0408
Fax: 704-599-3536


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of BERAUER,FRANK
(HP-Singapore,ex7)
Sent: Thursday, January 09, 2003 9:49 PM
To: 'General MEMS discussion'
Subject: [mems-talk] Glass or Silicon Bonding to Polymer

Dear MEMS-Colleagues,

For a microfluidic application, we want to bond a glass plate to a
Silicon
wafer
with a photo-patterned polymer layer inbetween.
We are free (within limits) to choose the polymer, which can be spin-on
or
laminate. We can also apply it to either the glass or the Silicon (or
both)
and
we can add additional layers (Oxide, SiN, metal) on either.
Do you have experience with similar processes or do you know where to
find
further information? Any hint is welcome.
Please note that we want to bond after patterning (and thus
cross-linking)
the
polymer.

Greetings,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore


-----Original Message-----
From: Shay Kaplan [mailto:shay@mizur.com]
Sent: Wednesday, January 08, 2003 11:46 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Dicing Saw Blades


Hi Cormac,
Try resinoid blades with 30-45u diamond. blade spped (on 21/4" blade)
~21KRPM

Shay

Cormac Eason wrote:

> Hi all,
>
> Could anyone recommend a dicing saw blade or blades suitable for
cutting
> the following combinations of materials:
>
> Silicon (0.5mm thick) anodically bonded to Pyrex (0.5mm thick)
>
> Pyrex (0.5mm thick) spin coated with a 5 micron layer of SU 8
>
> Silicon (0.5mm), with an electroplated Copper layer (0.4mm), topped
with a
> 5 micron thick SU 8 layer and a 0.5mm Pyrex layer.
>
> Thicknesses are approximate at the moment, but the maximum depth to
which
> I'll be cutting will be < 1.5mm
>
> The thickness of the blade doesn't matter to me as there is plenty of
room
> between samples, though the more vertical the cut edges are the
better.
> Thanks in advance for all assistance.
> --
>
> Regards,
> Cormac Eason
>
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