Frank,
          I do not have any direct experience in bonding glass plates to silicon
wafers but have done some work on surface tension inside micro fluidic channels.
More than one of our customers is using etched glass plates that are bonded to a
second glass plate to produce micro fluidic channels.  Their problem after
production was the surface tension of the side walls restricted fluidic flow
inside the narrow channels.  We worked with them and produced a surface tension
modifier that dehydrated the walls of the channels then treated them with a
silane that produced a permanent hydrophobic coating on the channel walls that
allowed free flow of liquid with no chemical contamination.  Let me know if you
have a problem with stiction/surface tension and I can run tests for you.  The
modification will obviously withstand any exposure to atmosphere once done.
Bill Moffat

-----Original Message-----
From: BERAUER,FRANK (HP-Singapore,ex7) [mailto:frank.berauer@hp.com]
Sent: Thursday, January 09, 2003 6:49 PM
To: 'General MEMS discussion'
Subject: [mems-talk] Glass or Silicon Bonding to Polymer


Dear MEMS-Colleagues,

For a microfluidic application, we want to bond a glass plate to a Silicon
wafer
with a photo-patterned polymer layer inbetween.
We are free (within limits) to choose the polymer, which can be spin-on or
laminate. We can also apply it to either the glass or the Silicon (or both)
and
we can add additional layers (Oxide, SiN, metal) on either.
Do you have experience with similar processes or do you know where to find
further information? Any hint is welcome.
Please note that we want to bond after patterning (and thus cross-linking)
the
polymer.

Greetings,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore


-----Original Message-----
From: Shay Kaplan [mailto:shay@mizur.com]
Sent: Wednesday, January 08, 2003 11:46 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Dicing Saw Blades


Hi Cormac,
Try resinoid blades with 30-45u diamond. blade spped (on 21/4" blade)
~21KRPM

Shay

Cormac Eason wrote:

> Hi all,
>
> Could anyone recommend a dicing saw blade or blades suitable for cutting
> the following combinations of materials:
>
> Silicon (0.5mm thick) anodically bonded to Pyrex (0.5mm thick)
>
> Pyrex (0.5mm thick) spin coated with a 5 micron layer of SU 8
>
> Silicon (0.5mm), with an electroplated Copper layer (0.4mm), topped with a
> 5 micron thick SU 8 layer and a 0.5mm Pyrex layer.
>
> Thicknesses are approximate at the moment, but the maximum depth to which
> I'll be cutting will be < 1.5mm
>
> The thickness of the blade doesn't matter to me as there is plenty of room
> between samples, though the more vertical the cut edges are the better.
> Thanks in advance for all assistance.
> --
>
> Regards,
> Cormac Eason
>
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