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  • Au-Au bonding (Brubaker Chad)
  • Gold Grains (Renie Duvall)
  • Etchant of oxide in present of Aluminium as mask (saroj kumari rathore)
  • help needed (vishu suram)
  • PR for KOH etching (Jan Lichtenberg (AMMT GmbH))
  • Low stress Silicon Nitride by LPCVD (Marcus Törndahl)
  • evaporation of nickel on nitride (William Lanford-Crick)
  • oxide wet etch on ito (William Lanford-Crick)
  • resist on rectangular shape slides (Brubaker Chad)
  • High frequency capacitance readout (Shane Arthur McColman)
  • evaporation of nickel on nitride (Kirt Williams)
  • evaporation of nickel on nitride (Phillipe Tabada)
  • High-g Acceorometer Design (\"Ozgur Erdener\")
  • WSiN (William Lanford-Crick)
  • RIE of poly-Si on Si3N4 (Makuc, Boris)
  • High-g Acceorometer Design (Mary-Ann Maher)
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