Samsung has improved on the current 8-layer High Bandwidth Memory-2 (HBM2) products by squeezing an extra four layers into the same thickness sandwich. Called 12-layer 3D-TSV (Through Silicon Via) technology, this relies on the pinpoint alignment of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of ...
Common issues of the present gravimetry technologies include their high cost, high mass, and large volume, which can potentially be solved by micro-electromechanical-system (MEMS) technology. However, the reported MEMS gravimeter does not have a high sensitivity and a large dynamic range comparable with those of the present commercial ...
In a report recently published in Nature Communications, a research group led by Associate Professor Joel Yang from the Singapore University of Technology and Design (SUTD) printed probably the smallest colorful 3-D model of the Eiffel Tower. Impressively, no pigments or inks were used. Instead, the 3-D-printed model of the Eiffel Tower ...
MEMS-based micro speakers are attractive candidates as sound transducers for smart devices, particularly wearables and hearables. For such devices, high sound pressure levels, low harmonic distortion and low power consumption are required for industrial, consumer and medical applications. The ability to integrate with microelectronic circuitry ...
It’s one of FormFactor’s strategic priorities to expand our leadership in advanced packaging and MEMS applications, and we are excited to welcome Dr. Thomas Fries and the FRT team to the FormFactor family,” said Dr. Mike Slessor, CEO of FormFactor. The acquisition of FRT: Expands FormFactor’s addressable market by $150 million ...
