The University of Tokyo has created a thermo-mechanical micromachine that can sense terahertz electromagnetic radiation, without the need for cryogenic cooling. THz cameras is a possible application. The device is a beam suspended across a gap, coated with ...
Company to present on high-vacuum system which provides direct bonding of 'anything on anything' at IEEE ECTC EV Group (EVG), a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and compound semiconductors, will be presenting on ...
Compoundsemiconductor.net: 2019-05-21 - MEMS business
Following a continued partnership with JDC including an extensive capital investment in a complete tool set, enabling successful wafer to wafer bonding. Plessey has succeeded in wafer level bonding of its GaN-on-Silicon monolithic microLED wafers with JDC ...
Scanning probe instruments can't imagine anything as large as luggage, however; they are more useful for measuring structures on length scales from the single atom level to the micro-scale.
The US Defence Advanced Research Projects Agency (Darpa) has officially funded a programme to develop a brain-to-machine interface – in the form of a headset designed to let military personnel control weapons through brain activity alone. The Next ...
