I'm a bit confused. I actually have used a quartz container to perform deep KOH
etching, and it seemed quite suitable to me.  Granted, KOH does etch fused
silica, but at an extremely low rate (.0014 um/min, or roughly 1/1000 the rate
of silicon).  This container was ~1 cm thick, so it would take ~5000 days of
continuous etching to get all the way through (or for a more reasonable figure,
~1.5 years of continuous etching to lose about a tenth of the thickness of the
container).

We obtained ours from Transene, Inc.


Best Regards,
Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
C.Brubaker@EVGroup.com, www.EVGroup.com

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 -----Original Message-----
From:   Mark West [mailto:mwest@imtecacculine.com]
Sent:   Thursday, August 07, 2003 10:27 AM
To:     mems-talk@memsnet.org
Subject:        [mems-talk] Tanks for KOH etching

What is the preffered type of tank for KOH etching? Load is a single 25
wafer cassette of 4" wafers. temp range is 80 - 100 C.

Quartz is not compatible and plastic tanks are difficult to heat. Just
wondering if anyone has found a good product for this application.

M. W.
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