You need high bias power. BCl3 helps if you've got it. Dry etching is
mostly physical with a minor chemical component. Etch rates will be a few
hundred angstroms/min, best case. You don't mention if you require
selectivity to a mask or if you have a mask present. For stopping on the
alumina, some CF4 or other source of fluorine will help.
Robert
On Mar 24, 2011 3:49 PM, "Tony Price" wrote:
> Hello,
>
> Can anyone recommend an RIE recipe for etching RF sputtered barium
strontium
> titanate? It is ~ 500nm thick and it's on alumina substrates.
>
> Thanks,
>
> Tony Price