How to remove scallop polymer residual after STS2 DRIE
Mehmet Yilmaz
2015-12-14
Dear Youmin,
You may try ALEG 380. The link for the product is below:
http://www.avantormaterials.com/Electronic-Materials/Markets-and-Applications
/Semiconductor-Chemicals/Post-Etch-Residue-Removal.aspx
I used ALEG 380 at 80 degress Celcius temperature. And it definitely worked
in my case. However, I see that your features are way more smaller than
what I had when I used ALEG 380. My lines and spaces were 2um/2um.
I hope this helps! Good luck!
Bests,
Mehmet
On Sun, Dec 13, 2015 at 9:32 PM, Youmin Wang
wrote:
> Hello Everyone,
>
> I want to etch the silicon structure below to half of its heigh (from 2un
> to 1um) in standard BOSCH process:
>
> [image: Inline image 1]
>
> However I got a lot of sidewalls un-removed:
>
> [image: Inline image 2]
>
>
> I tried with EKC270 post-etch cleaning but there are still quite a few
> sidewalls still there, topview is like:
>
> [image: Inline image 3]
>
> Do you think whether my etching recipe has any problem, or you know
> whether I can do something post-etch to clean those standing sidewalls?
> Thanks a lot!
>
>
>
> Best,
> Youmin
>
>
>
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