How to remove scallop polymer residual after STS2 DRIE
Youmin Wang
2015-12-14
Hello Mehmet,
Thank you very much for your suggestions!!
I have worked with EKC270 from DuPont:
http://www.dupont.com/content/dam/assets/products-and-services/electronic-
electrical-materials/assets/EKC/EKC270.pdf
I think they both remove the polymer and try to "lift off" the residue by
etching the substrate slightly? Thanks in advance for your comments.
Best,
Youmin
On Mon, Dec 14, 2015 at 9:28 AM, Mehmet Yilmaz
wrote:
> Dear Youmin,
> You may try ALEG 380. The link for the product is below:
>
> http://www.avantormaterials.com/Electronic-Materials/Markets-and-Applications
/Semiconductor-Chemicals/Post-Etch-Residue-Removal.aspx
>
> I used ALEG 380 at 80 degress Celcius temperature. And it definitely
> worked in my case. However, I see that your features are way more smaller
> than what I had when I used ALEG 380. My lines and spaces were 2um/2um.
>
> I hope this helps! Good luck!
>
> Bests,
>
> Mehmet
>
> On Sun, Dec 13, 2015 at 9:32 PM, Youmin Wang
> wrote:
>
>> Hello Everyone,
>>
>> I want to etch the silicon structure below to half of its heigh (from 2un
>> to 1um) in standard BOSCH process:
>>
>> [image: Inline image 1]
>>
>> However I got a lot of sidewalls un-removed:
>>
>> [image: Inline image 2]
>>
>>
>> I tried with EKC270 post-etch cleaning but there are still quite a few
>> sidewalls still there, topview is like:
>>
>> [image: Inline image 3]
>>
>> Do you think whether my etching recipe has any problem, or you know
>> whether I can do something post-etch to clean those standing sidewalls?
>> Thanks a lot!
>>
>>
>>
>> Best,
>> Youmin
>>
>>
>>
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>