Hi,

        May I add a question? I've tried to ash SU-8 with O2 plasma in
ICP/RIE system. But there is a film of residue on wafer. Have you seen
such problem?

Isaac


On Fri, 7 Mar 2003 BobHendu@aol.com wrote:

> What type of reactor do you have? Is it a barrel asher or a single wafer
system. OUr experience with oxygen and su8 shows it will ash but it is better if
you have not done the second bake. This has been done in an icp/rie system and
the etch rate is a little less than other negative working photoresists. Bob
Henderson
>
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Yours sincerely,

Isaac Chan

Ph.D. Candidate
Dept. Electrical & Computer Engineering
University of Waterloo
200 University Ave. W
Waterloo, Ontario, Canada
N2L 3V1
Tel: (519) 729-6409, ext. 6014
Fax: (519) 746-6321
iwchan@venus.uwaterloo.ca
http://www.ece.uwaterloo.ca/~a-sidic