Hi,
May I add a question? I've tried to ash SU-8 with O2 plasma in
ICP/RIE system. But there is a film of residue on wafer. Have you seen
such problem?
Isaac
On Fri, 7 Mar 2003 [email protected] wrote:
> What type of reactor do you have? Is it a barrel asher or a single wafer
system. OUr experience with oxygen and su8 shows it will ash but it is better if
you have not done the second bake. This has been done in an icp/rie system and
the etch rate is a little less than other negative working photoresists. Bob
Henderson
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/
>
Yours sincerely,
Isaac Chan
Ph.D. Candidate
Dept. Electrical & Computer Engineering
University of Waterloo
200 University Ave. W
Waterloo, Ontario, Canada
N2L 3V1
Tel: (519) 729-6409, ext. 6014
Fax: (519) 746-6321
[email protected]
http://www.ece.uwaterloo.ca/~a-sidic