There is a HF formulation with acetic acid, ethylyne
glycol and aluminium fluoride known as pad etch if
memory serves me right that was used to open vias
through oxide to aluminium pads known as pad etch
(search previous threads in the archive).
This may not work if you have a variety of materials
due to electrochemical potentials destroying the
passivating layer.
Best regards,
Mark
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----- Original Message -----
From: "bobo"
To:
Sent: Thursday, May 15, 2003 5:30 AM
Subject: [mems-talk] Etching SiO2 without affecting Aluminum
> Dear all,
> does anyone knows what wet etchant can etching silicon dioxide without
etching aluminum at the same time? Thanks.
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