Hello all,
  I am interested in bonding two glass wafers (one can be pyrex) together.
prior to bonding i etch a microchannel into of the substrates using BOE. Does
anyone know of materials that can be used as a masking material for BOE etching
and as an intermediate layer for bonding?I know that aluminium can be used as a
intermediate layer for bonding but it does not hold up to the BOE etching. I am
also will to try gold-gold thermocompression bonding but am not familar with the
process so if someone also has information on this bonding method it will be
greatly appreciated.

Thank you.
Ryan

Ryan D. Pooran
Ph.D Candidate Microelectronics-Photonics
Mechanical Engineering Department
University of Arkansas
Fayetteville, AR 72701
Ph:479-575-4150
Fax: 479-575-6982
e-mail: rpooran@uark.edu