Dear All,
A good reference for gold-gold thermocompression bonding is as follows:
C.H. Tsau, M. A. Schmidt, S.M. Spearing, "Fabrication Process and Plasticity of
Gold-Gold Thermocompression Bonds," 6th Symposium on Semiconductor Wafer
Bonding: Science, Technology, and Applications, ECS Proceedings, 2001
In general, gold is resistant to BOE (and many other chemistries), and so may
serve as an etch mask. However, gold adhesion is notoriously bad, so you will
want to use Ti as an adhesion layer. Also, bear in mind that BOE is an isotropic
etch process, and so there will definitely be some undercutting during the etch
(especially if you are doing a deep etch).
We do manufacture wafer level bonding equipment, and as such, have a large
amount of experience in many forms of wafer bonding, such as the
thermocompression process being discussed, and with direct bonding processes
such as those mentioned below, as well as those using various surface activation
methods. If you have any further questions or concerns, feel free to contact me,
or to browse our website at www.evgroup.com.
Best Regards,
Chad Brubaker
EV Group invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com
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-----Original Message-----
From: Carsten Wesselkamp [mailto:[email protected]]
Sent: Thursday, August 07, 2003 7:20 AM
To: General MEMS discussion
Subject: RE: [mems-talk] Glass-Glass bonding
Dear Ryan,
it is possible to do a direct bonding of glass to glass without any
intermediate layer. This process can be done at Plan Optik GmbH in Germany.
If you are interested - please contact me directly.
Best regards,
Carsten Wesselkamp
Plan Optik GmbH
Germany
http://www.planoptik.com
Tel.: +49-2664-5068-25
Fax: +49-2664-5068-91
-----Original Message-----
From: BRAD JOHNSON [mailto:[email protected]]
Sent: Wednesday, August 06, 2003 6:29 PM
To: [email protected]; [email protected]
Subject: Re: [mems-talk] Glass-Glass bonding
Ryan,
We have great experience in this area. I also have a trick that may work
for you that will be much easer if your process will allow it. Please
contact me direct.
Brad Johnson
Suss MicroTec
Bonding Application Engineer
8240 S. Kyrene Rd. Suite 101
Tempe Arizona 850284
1-800-685-7877 Ext 119
Fax 480-557-9371
e-mail [email protected]
www.suss.com
>>> [email protected] 08/05/03 01:56PM >>>
At 04:45 PM 8/4/2003 -0500, you wrote:
>Hello all,
> I am interested in bonding two glass wafers (one can be pyrex) together.
prior to bonding i etch a microchannel into of the substrates using BOE.
Does anyone know of materials that can be used as a masking material for
BOE etching and as an intermediate layer for bonding?I know that aluminium
can be used as a intermediate layer for bonding but it does not hold up to
the BOE etching. I am also will to try gold-gold thermocompression bonding
but am not familar with the process so if someone also has information on
this bonding method it will be greatly appreciated.
>
>Thank you.
>Ryan
>
Well you could do your BOE etch of the glass. Most standard photoresists
should stand up to that. Then sputter aluminum on, pattern and etch that
with an aluminum etchant to expose your channels, and then do your bond.
--
Mark Fuller
Microelectronics Fabrication Facility
Washington State University
Dana Hall 102
Pullman, WA 99164-2711
(509)335-1797
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