Ryan,
We have great experience in this area.  I also have a trick that may work for
you that will be much easer if your process will allow it.  Please contact me
direct.

Brad Johnson
Suss MicroTec
Bonding Application Engineer
8240 S. Kyrene Rd. Suite 101
Tempe Arizona 850284
1-800-685-7877 Ext 119
Fax 480-557-9371
e-mail [email protected]
www.suss.com

>>> [email protected] 08/05/03 01:56PM >>>
At 04:45 PM 8/4/2003 -0500, you wrote:
>Hello all,
>  I am interested in bonding two glass wafers (one can be pyrex) together.
 prior to bonding i etch a microchannel into of the substrates using BOE.
Does anyone know of materials that can be used as a masking material for
BOE etching and as an intermediate layer for bonding?I know that aluminium
can be used as a intermediate layer for bonding but it does not hold up to
the BOE etching. I am also will to try gold-gold thermocompression bonding
but am not familar with the process so if someone also has information on
this bonding method it will be greatly appreciated.
>
>Thank you.
>Ryan
>

Well you could do your BOE etch of the glass.  Most standard photoresists
should stand up to that.  Then sputter aluminum on, pattern and etch that
with an aluminum etchant to expose your channels, and then do your bond.

--
Mark Fuller
Microelectronics Fabrication Facility
Washington State University
Dana Hall 102
Pullman, WA  99164-2711
(509)335-1797