Dear Ryan,

it is possible to do a direct bonding of glass to glass without any
intermediate layer. This process can be done at Plan Optik GmbH in Germany.

If you are interested - please contact me directly.

Best regards,

Carsten Wesselkamp

Plan Optik GmbH
Germany
http://www.planoptik.com

Tel.: +49-2664-5068-25
Fax: +49-2664-5068-91




-----Original Message-----
From: BRAD JOHNSON [mailto:BJOHNSON@suss.com]
Sent: Wednesday, August 06, 2003 6:29 PM
To: mems-talk@memsnet.org; mark_fuller@wsu.edu
Subject: Re: [mems-talk] Glass-Glass bonding


Ryan,
We have great experience in this area.  I also have a trick that may work
for you that will be much easer if your process will allow it.  Please
contact me direct.

Brad Johnson
Suss MicroTec
Bonding Application Engineer
8240 S. Kyrene Rd. Suite 101
Tempe Arizona 850284
1-800-685-7877 Ext 119
Fax 480-557-9371
e-mail bjohnson@suss.com
www.suss.com

>>> mark_fuller@wsu.edu 08/05/03 01:56PM >>>
At 04:45 PM 8/4/2003 -0500, you wrote:
>Hello all,
>  I am interested in bonding two glass wafers (one can be pyrex) together.
 prior to bonding i etch a microchannel into of the substrates using BOE.
Does anyone know of materials that can be used as a masking material for
BOE etching and as an intermediate layer for bonding?I know that aluminium
can be used as a intermediate layer for bonding but it does not hold up to
the BOE etching. I am also will to try gold-gold thermocompression bonding
but am not familar with the process so if someone also has information on
this bonding method it will be greatly appreciated.
>
>Thank you.
>Ryan
>

Well you could do your BOE etch of the glass.  Most standard photoresists
should stand up to that.  Then sputter aluminum on, pattern and etch that
with an aluminum etchant to expose your channels, and then do your bond.

--
Mark Fuller
Microelectronics Fabrication Facility
Washington State University
Dana Hall 102
Pullman, WA  99164-2711
(509)335-1797