We use 1813 on top of LOR-B for metal liftoff as well as AZ-5214 with image
reversal.  Both processes give a nice undercut profile for lift-off.  If
either of these are options for you, I can give you specific processes.

AZ-5214 is nice to have around because it can be used either as a positive
or a negative-tone resist.

BTW, also  make sure that metal evaporation is normal to your substrate,
i.e. the sample is placed directly over the metal source in evaporator or
sputterer.  This will help ensure clean lift-off because the resist
side-walls are less likely to have metal on them.

-Bill Lanford-Crick

-----Original Message-----
From: mems-talk-bounces+wlanford=uiuc.edu@memsnet.org
[mailto:mems-talk-bounces+wlanford=uiuc.edu@memsnet.org]On Behalf Of
Karin Buchholz
Sent: Friday, December 05, 2003 1:40 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Lift-Off


Hi Bernd,

we use the Microposit S1818 for Lift-off, it is quite thick (the last
two numbers are related to the thickness, so the S1805 is much thinner
at the same spin rate) p.e.the S1818 is arond 1.6 µm @ 6000 rpm, 40s. To
get an undercut you can also try to put the samples 15 min in
Chlorobenzene after the softbake and exposure before the development.
(Chlorobenzene is tumourigenic, so use a well ventilated place and
prevent Daylight exposure during the 15 min, p.e. by aluminum Foil)

Good luck,

Karin


Krueger, Bernd (Unaxis Optics BZ) schrieb:

>Dear All,
>
>does anybody has experience in a metal-lift-off-process? I am searching for
>a resist working fine for soft metal with a thickness of about 300nm. May
be
>you can advise me either negative or positive resists.
>
>I would appreciate any help,
>Thanks in advance,
>
>Bernd Krueger
>

--
Dipl.-Ing. Karin Buchholz

Walter Schottky Institut
Technische Universitaet Muenchen
email: buchholz@wsi.tum.de




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