Switch from SU-8 to KMPR (also from Microchem). SU-8 isn't meant to be
easily removable, whereas KMPR is specifically designed for robustness
during electroplating followed by a relatively easy removal.
On Mon, Mar 18, 2013 at 9:33 PM, Jocelyn Ng wrote:
> Dear all,
> I'm using SU-8 2005.
> I soft bake at 65C_540S, exposure dose is 60mJ and post exposure bake at
> Recently I encounter a problem where, after undergone gold plating process,
> photoresist residue remains.
> My stripping(remover PG) process is at 65C for an hour followed by acetone
> bath in ultrasonic.
> My plating temperature is about 45C for 25minutes.
> I tried to strip in remover PG for another 30minutes but nothing seemed to
> be working.
> I had tried using the same condition previously and did not encounter this
> I need some advice or comments on this.
> Thanks a lot in advance.
> Best Regards,
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