In order to get it to come off well you will need to use OmniCoat
adhesion layer from Micro Chem before putting down the Su-8. Then the
OmniCoat and SU-8 comes right off (in principle) with remover PG.
On Tue, Mar 19, 2013 at 12:33 AM, Jocelyn Ng wrote:
> Dear all,
> I'm using SU-8 2005.
> I soft bake at 65C_540S, exposure dose is 60mJ and post exposure bake at
> Recently I encounter a problem where, after undergone gold plating process,
> photoresist residue remains.
> My stripping(remover PG) process is at 65C for an hour followed by acetone
> bath in ultrasonic.
> My plating temperature is about 45C for 25minutes.
> I tried to strip in remover PG for another 30minutes but nothing seemed to
> be working.
> I had tried using the same condition previously and did not encounter this
> I need some advice or comments on this.
> Thanks a lot in advance.
> Best Regards,
> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
> provider of MEMS and Nanotechnology design and fabrication services.
> Visit us at http://www.mems-exchange.org
> Want to advertise to this community? See http://www.memsnet.org
> To unsubscribe:
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
Want to advertise to this community? See http://www.memsnet.org