| - Affix Technologies
- Products and services include: SOI wafer, silicon on glass, silicon direct bonding, and bonding services.
- ANK America, Inc.
- SOI Wafers 4/5/6/8". All work done in house from ingot slicing to final polish. No out sourcing, low cost, fast delivery, perfect edges, device tolerance down to +/- 0.5um.
- IceMos Technology, Ltd
- Icemos Technology Ltd is a leading supplier of high
quality thick film bonded SOI (Silicon On Insulator)
wafers (Bonded SOI Wafers, Si-Si Bonded Wafers, and
SOI+Trench and Refill). Our expertise is on trench
etch and refill technology, with the ability to offer
trench etch and refill services to customers on bulk
Si substrates or on SOI. By combining both our SOI and
trench etch and refill technology, we provide
customers a unique dielectrically isolated substrate
preparation service.
- Isonics
-
Manufactures 4/5/6/8" SOI wafers.
- MEMC
- MEMC is a leading global supplier of wafers to the semiconductor industry. Wafers are the fundamental building block on which nearly all microelectronic applications are made. These applications, or “devices”, make possible the Internet and electronic commerce, computers, consumer electronics, automobiles, telecommunications, industrial automation and control systems, and analytical and defense systems.
- Motorola
- We’re scientists. We’re artists. Most of all, we are a global communications leader, powered by, and driving, seamless mobility. Motorola is revolutionizing broadband, embedded systems and wireless networks – bringing cutting-edge technologies into your everyday life, with style.
- SiGen
- The vision of SiGen is to become the leading provider of cost effective manufacturing solutions for advanced material substrates of exceptional specification for the microelectronic and photonic industries through the SiGen NanoTec™ suite of process technologies.
- SOITEC sa
- The leading supplier of SOI wafers and other engineering
substrates
- Ultrasil
-
Produces SOI wafers from 100-200 mm in diameter,
with device thicknesses from 2 microns and up, made by fusion bonding.
- Wafer World, Inc.
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MEMS and Nanotechnology Clearinghouse